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Upcoming Event: IMAPS ThermCon

Arieca’s own Benjamin Dorau will be presenting at IMAPS ThermCon in San Diego on October 3 with a talk entitled: “High Performance Liquid Metal Embedded Elastomers for Thermal Management in Consumer Electronics and Data Center Applications.”

This session will dive into how Liquid Metal Embedded Elastomer (LMEE) thermal interface materials are redefining what’s possible in cooling — delivering the thermal conductivity of liquid metal with the reliability and ease-of-use of a polymer.

You won’t want to miss this talk!

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