EXT Product Portfolio

Easy-to-use liquid metal replacement for TIM1.5/TIM2


APPLICATIONS

  • AI Data Centers XPUs (GPU, CPU, TPU, Co-Packaged Optics (CPO)) with large warpage 
  • AI-enabled Laptops/PCs
  • Smartphones and other mobile edge AI devices

FEATURES

  • Thermal gel emulsion of liquid metals
  • Extremely low thermal resistance, achieving 2 mm2K/W at minimum BLT
  • Long-term reliability superior to thermal grease
  • Easy to use and clean
  • High thermal conductivity
  • Meets ASHRAE, IEC reliability standards
  • RoHS compliant

EXT PRODUCTS

EXT LMEEs are ideal for high warpage BLT applications in TIM1.5/TIM2 applications. For information on our products in the EXT product portfolio, contact us using the form below.

Responsive Comparison Table
Property EXT-510X
Thermal Resistance @ BLT (mm²K/W) 15 @ 150 µm
10 @ 100 µm
5 @ 50 µm
2.5 @ 25 µm
2 @ 20 µm
Thermal Conductivity (W/mK) 10-12
HAST Performance 96 h
(50°C/95% RH)
Thermal Shock Test 72 cycles
(0°C to 125°C)
Power Cycling 10,000+
(ongoing)

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