Arieca is revolutionizing thermal interface materials (TIMs) for SiC power modules and other high-power electronics. Our pioneering LMEE formulations blend liquid metal and polymer to combine superior thermal performance with exceptional mechanical reliability — enabling next-generation computing to reach new levels of speed and performance without compromising energy efficiency.
SUPERIOR THERMAL PERFORMANCE
Unlike thermal greases and vertically aligned carbon or metals, which create inefficient heat transfer pathways under compression, Arieca’s liquid metal droplets compress such that contact resistance is minimized and ultra-low thermal resistance can be achieved.
This unique combination of mechanical conformability and high metallic loading results in TIMs with a thermal resistance as low as 2 mm2K/W at a bondline thickness (BLT) of 20 μm.
SUPERIOR MECHANICAL DURABILITY
Solid TIMs, such as indium alloys and sintered silver, experience cracks and delamination when packages warp during exposure to hot and cold temperatures.
Arieca’s LMEEs have extremely high stretchability and adhesion, so they maintain both mechanical integrity and thermal performance throughout assembly, thermal shock, and use.
SUPERIOR LONG-TERM
RELIABILITY
Unlike pure liquid metal, LMEEs have complete polymer encapsulation and experience no degradation in harsh environmental conditions
LMEE IS THE ONLY TIM THAT DOES IT ALL
Only Arieca’s unique LMEE products provide the thermal, mechanical, and reliability performance required in the ever-demanding semiconductor market.
| Formulation | Polymer-TIMs | Vertically Aligned Metal/Carbon w/out LM |
Vertically Aligned Metal/Carbon w/ LM |
Solid-TIM (Indium Alloys) |
Liquid Metal (LM) |
Arieca’s LMEE |
|---|---|---|---|---|---|---|
| Thermal Resistance (mm²K/W) |
5 - 64 | 8 - 15 | 1 - 15 | 4 - 7 | 2 (TSMC) | 1 - 10 |
| Strain at Break (%) | 50 - 100 | < 10 | < 10 | 5 – 50 | NA | 200 - 300 |
| Shore Hardness | Very low (OO-20) | Moderate | Moderate | High (but malleable) | NA | Very low (OO-20) |
| Adhesion | Very low to high adhesion | Very Low | Very Low | Moderate (assisted backside metallization) | NA | High |
| Thermal Shock | Moderate to poor | Poor | Poor | Poor | Poor | High |
| High Temperature and Humidity | Moderate to poor | High | Poor | High | Extremely poor | High |