AI is driving tremendous growth in computing power and a subsequent explosion in energy required for cooling. Whether at the chip level or the system level, more efficient thermal management is critical to meeting the demands of the growing power density roadmap in high-performance computing. Unlike any other TIM materials, Arieca’s LMEE TIMs deliver the extremely high high dissipation provided by liquid metal, but without the accompanying manufacturing complexity or reliability challenges.
DATA CENTER
Minimizing energy use, reducing CO₂ emissions, and maximizing system performance is essential to sustainable thermal management in data centers, and thermal interface materials are a critical piece of this solution. Arieca’s ULT LMEE overcomes the difficult reliability and manufacturing challenges of today’s thermal interface materials and unlocks the door to the next generation of high-density computing.
ADVANCED CHIPLET PACKAGING
The ultimate heat dissipation solution requires direct interfacing between the silicon die and the heat sink – eliminating the thermal resistance of the package lid. Arieca’s ULT LMEE sets a new bar for ultra-low thermal resistance and thin BLT, making it the ideal choice to meet the needs of high-performance chiplet packaging.
