With the integration of AI into edge devices, preventing overheating and maintaining chip performance requires improved heat transfer between CPUs, GPUs, and other AI accelerators and their cooling systems. Particularly in small mobile devices where there is not room for a fan, the resistance of the TIM between the heat generating element and the heat sink or exterior case is critical. Arieca’s LMEE TIMs enable highly reliable heat dissipation solutions that maximize processor performance and prevent overheating.
AI-INTEGRATED SMARTPHONES/LAPTOPS
AI integration into smartphones, laptops, and other edge devices requires advanced cooling solutions. As compared with thermal grease and PCMs, EXT LMEE improves the cooling of smartphone and laptop CPUs/GPUs, minimizing processor throttling and maintaining processor speed and responsiveness for end-user satisfaction. Additionally, EXT LMEE maintains thermal resistance and adhesion through solder reflow and comprehensive thermal shock testing.
