APPLICATIONS
FEATURES
SiC MODULE REFERENCE DESIGN
Arieca’s ALT products have been used to bond ROHM Semiconductor’s cutting-edge SiC molded TRCDRIVE pack™ power modules to a heat sink, enabling a reliable, cost-effective cooling solution for electric vehicle (EV) powertrains in the industry’s most compact form factor.
ALT PRODUCTS
ALT LMEEs span a range of adhesion and thermal resistances. For help selecting the product that is right for your application, contact us info@arieca.com.
Property | ALT-304-90 | ALT-416-90 |
---|---|---|
Thermal Resistance @ BLT (mm²K/W) | 13 @ 20 μm 33 @ 40 μm |
7 @ 20 μm 11 @ 30 μm |
Strain at Break (%) | 250 | 225 |
Elastic Modulus (kPa) | 600 | 450 |
Lap Shear Strength (kPa) | 600 | 350 |