Arieca

ALT Product Portfolio

Highly adhesive TIMs for demanding environmental conditions

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APPLICATIONS

  • SiC power modules
  • DC/DC converters
  • Other high power electronics for electric vehicles and fast charging stations
  • Other high temperature applications
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FEATURES

  • Highly adhesive, single-component TIM
  • Low thermal resistance
  • Thin BLT
  • High adhesion and elongation (no clips required)
  • Lower temperature/pressure curing process: 150 °C for 10 minutes @ 400 kPa
  • Operating temperature -55 °C to 250 °C
  • Time-pressure, slit-coat, and stencil dispense compatible   
  • Excellent reliability in extreme environmental conditions
  • Meets AQG324 automotive reliability standards
  • RoHS Compliant

SiC MODULE REFERENCE DESIGN

Arieca’s ALT products have been used to bond ROHM Semiconductor’s cutting-edge SiC molded TRCDRIVE pack™ power modules to a heat sink, enabling a reliable, cost-effective cooling solution for electric vehicle (EV) powertrains in the industry’s most compact form factor.

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ALT PRODUCTS

ALT LMEEs span a range of adhesion and thermal resistances. For help selecting the product that is right for your application, contact us at info@arieca.com.

Responsive Comparison Table
Property ALT-304-90 ALT-416-90
Thermal Resistance @ BLT (mm²K/W) 13 @ 20 μm
33 @ 40 μm		 7 @ 20 μm
11 @ 30 μm
Strain at Break (%) 250 225
Elastic Modulus (kPa) 600 450
Lap Shear Strength (kPa) 600 350
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